24-09-2026 11:26 via electronicsweekly.com

Advanced packaging to be a $51bn market by 2031

AI accelerators , HBM Integration, and Co-packaged optics are pushing higher performance packaging past  $51 billion by 2031, says Yole. High-end performance packaging revenue has a 27% CAGR during 2025-2031. […]
The post Advanced packaging to be a $51bn market by 2031 appeared first on Electronics Weekly.
Read more »

Electronics news



Bel Fuse high-density DC-DC converters track railway applications
Lattice Mach-N2 FPGA family targets system control and security
Univity achieves first in-orbit 5G NTN TDD connection via mmWave link
Japan ponders Starlink alternatives
YMTC wins patent battle against Micron
Qualcomm buys PickNik
Qualcomm buys PickNick
Cambridge Tech Week draws 1,700 visitors
Test Arduino’s VENTUNO Q SBC for free
Declining polls for President Trump
SOSA-aligned TVPX210 3U OpenVPX carrier board offers modular I/O
RAF Space Squadron forms to defend Britain’s satellites
UKSA backs Filtronic to develop RF over IP for digital satellite ground networks
Sponsored Content: Designing Backup Power for Electronic Door Release After a Vehicle Crash
Desktop versie